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Journal paper

 (2008~2015, NCCU)

  1. C.-H. Wang* and H.-T. Shen, Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate, Intermetallics, Vol. 18, pp.616-622, (2010).

  2. C.-H. Wang, C.-N. Chiu, and S.-W. Chen, Investigations on interfacial reactions at reentrant corners, Journal of Materials Research, Vol. 25, pp. 999-1003, (2010).

  3. C.-H. Wang* and C.-Y. Kuo, Coupling effect of the interfacial reaction in Co/Sn/Cu diffusion couples, Journal of Electronic Material, Vol. 39, pp. 1303-1308, (2010).

  4. C.-Y. Kuo and C.-H. Wang*, Interfacial reactions between Sn and Co-Cu substrates, Journal of Engineering, National Chung Hsing University, Vol. 21, pp. 55-64, (2010) (in Chinese).

  5. S. Knott, Z. Li, C.-H Wang, and A. Mikula, Electromotive force measurements in the ternary system Bi-In-Zn, Metallurgical and Materials Transactions A, Vol. 41, pp. 3130-3135, (2010).

  6. C.-H. Wang* and H.-H. Chen, Study of  the  effects of Zn content on the interfacial reactions between Sn-Zn solders and Ni substrate at 250oC, Journal of Electronic Materials, Vol. 39, pp. 2375-2381, (2010).

  7. C.-H. Wang*, C.-Y. Kuo, H.-H. Chen, and S.-W. Chen, Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing, Intermetallics, Vol. 19, pp.75-80, (2011).   

  8. C.-H. Wang* and C.-Y. Kuo, Interfacial reactions between eutectic Sn-Pb solder and Co substrate, Journal of Materials Science, Vol. 46, pp. 2654-2661, (2011).

  9. W.-K. Liao, C.-M. Chen, M.-T. Lin, and C.-H. Wang, Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains, Scripta Materialia, Vol. 65, pp. 691-694, (2011).

  10. C.-H. Wang* and C.-Y. Kuo, Growth kinetics of the solid-state interfacial reactions in the Sn-Cu/Co and Sn/Co-Cu couples, Materials Chemistry and Physics,  Vol. 130, pp. 651-656, (2011).

  11. C.-H. Wang*, H.-H. Chen, and W.-H. Lai, Effects of minor amounts of Zn on the Sn-Zn/Ni interfacial reactions and phase equilibria of the ternary Sn-Zn-Ni system at 250oC, Journal of Electronic Materials,
    Vol. 40, pp. 2436-2444, (2011).

  12. C.-H. Wang*, H.-H. Chen, P.-Y. Li, and P.-Y. Chu, Kinetic analysis of Ni5Zn21 growth at the interface between Sn-Zn solders and Ni, Intermetallics, Vol. 22, pp. 166-175, (2012).

  13. S.-W. Chen, A.-R. Zi, W. Gierlotka, C.-F. Yang, C.-H. Wang, S.-K. Lin, and C.-M. Hsu, Phase equilibria of Sn-Sb-Cu system, Materials Chemistry and Physics,  Vol. 132, pp. 703-715,  (2012).

  14. S.-W. Chen, C.-M. Chen, C.-H. Wang, and C.-M. Hsu, Effects of electromigration on electronic solder joints. Chapter 16 in the book, "Lead-free solders: materials reliability for electronics", John Wiley & Sons, pp. 403-424, (2012). (ISBN: 978-0-470-97182-6)

  15. C.-H. Wang*, H.-H. Chen, and P.-Y. Li,  Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate, Materials Chemistry and Physics, Vol. 136, pp. 325-333, (2012).

  16. C.-H. Wang*, S.-E. Huang, and J.-L. Liu, Liquid-state interfacial reactions of Sn-Zn/Co couples at 250oC, Journal of Electronic Materials, Vol. 41, pp. 3259-3265, (2012).

  17. C.-H. Wang*, C.-Y. Kuo, S.-E. Huang, and P.-Y. Li, Temperature effects on liquid-state Sn/Co interfacial reactions, Intermetallics, Vol. 32, pp. 57-63, (2013).

  18. C.-H. Wang* and P.-Y. Li, Microstructure evolution of Ni5Zn21 intermetallic compound at Sn-9 wt%Zn/Ni interface, Materials Chemistry and Physics, Vol. 138, pp. 937-943, (2013).

  19. C.-H. Wang*, H.-T. Shen, and W.-H. Lai, Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints, Journal of Alloys and Compounds, Vol. 564, pp. 35-41, (2013).

  20. S.-W. Chen, J.-Y. Lin, C.-M. Hsu, J.-S. Chang, J.-G. Duh, and C.-H. Wang, Ag whisker formation in Ag-In-Se alloys, Metallurgical and Materials Transactions A, Vol. 44, pp. 5281-5283, (2013).

  21. C.-H. Wang*, W.-H. Lai, and S.-W. Chen, Dissolution and interfacial reactions of (Cu,Ni)6Sn5 intermetallic compound in molten Sn-Cu-Ni solders, Journal of Electronic Materials, Vol. 43, pp. 195-203, (2014).

  22. C.-H. Wang* and H.-H. Chen, Cruciform pattern of Ni5Zn21 formed in interfacial reactions between Ni and Sn-Zn solders, Journal of Electronic Materials, Vol. 43, pp. 1362-1369, (2014).

  23. C.-H. Wang*, P.-Y. Li, and K.-T. Li, Interfacial microstructure evolution between Sn-Zn solders and Ag substrate during solid-state annealing, Journal of Electronic Materials, Vol.43, pp. 4594-4601, (2014).

  24. C.-H. Wang*, S.-E. Huang, and  K.-T. Li, Inhibiting CoSn3 growth at the Sn/Co system by minor Zn addition, Intermetallics, Vol. 56, pp. 68-74, (2015).

  25. C.-H. Wang*, S.-E. Huang, and C.-W. Chiu, Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate, Journal of Alloys and Compounds, Vol. 619, pp. 474-480, (2015).

  26. C.-H. Wang*, P.-Y. Li, and K.-T. Li, Liquid-state interfacial reactions in Sn-Zn/Pd couples and phase equilibria of the Sn-Zn-Pd system at 260oC, Intermetallics, Vol. 59, pp. 68-74, (2015).

  27. C.-H. Wang* and C.-Y. Kuo, Peltier effect on CoSn3 growth in Sn/Co/Sn couples with different substrate lengths, Materials Chemistry and Physics, Vol. 153, pp.72-77, (2015).

  28. C.-H. Wang* and J.-L. Liu, Effects of Sn thickness on morphology and evolution of Ni3Sn4 grains formed between molten Sn and Ni substrate, Intermetallics, Vol. 61, pp. 9-15, (2015).

  29. S.-W. Chen, J.-S. Chang, C.-M. Hsu, J.-Y. Lin, and C.-H. Wang, Interfacial reactions in In/Ag2Se couples, Materials Chemistry and Physics, Vol. 162, pp. 11-14, (2015).

  30. C.-H. Wang*, C.-Y. Kuo, and N.-C. Yang, Phase equilibria of the ternary Sn-Pb-Co system at 250oC and interfacial reactions of Co with Sn-Pb alloys, Journal of Electronic Materials, Vol. 44, pp. 4567-4575, (2015).

  31. C.-H. Wang* and K.-T. Li, Strong effects of minor Ga addition on liquid-state Sn-Ga/Co interfacial reactions, Journal of Alloys and Compounds, Vol. 649, pp. 1197-1204, (2015).

  32. C.-H. Wang*, K.-T. Li, and C.-Y. Lin, Minor Ga addition to effectively inhibit PdSn4 growth between Sn solder and Pd substrate,  Intermetallics, Vol. 67, pp. 102-110, (2015).

  33. C.-H. Wang* and K.-T. Li, Growth kinetics and mechanism of Pd2Zn9 at the interface of Pd substrate with molten Sn-9wt.%Zn solder, Materials Chemistry and Physics, Vol. 164, pp. 223-229, (2015).

  34. C.-H. Wang*, J.-L. Liu, and H.-Y. Huang, Pseudocapacitive performance of Co(OH)2 enhanced by Ni(OH)2 formation on porous Ni/Cu electrode, Electrochimica Acta, Vol. 182, pp. 47-60, (2015).

  35. C.-H. Wang*, S.-E. Huang, and P.-Y. Huang, Phase equilibria of the ternary Sn-Zn-Co system at 250oC and 500oC, Journal of Electronic Materials, Vol. 44, pp. 4907-4919, (2015).

  36. C.-H. Wang* and K.-T. Li, Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints, Journal of Alloys and Compounds, Vol. 654, pp. 546-553, (2016).

  37. C.-H. Wang*, C.-C. Wen, and C.-Y. Lin, Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer on a Cu substrate, Journal of Alloys and Compounds, Vol. 662, pp. 475-483, (2016)

  38. C.-H. Wang* and K.-T. Li, Metastable CoSn4 formation induced by Ga addition and effective suppression effect on the IMC growth in solid-state Sn-Ga/Co reactions, Journal of Materials Science, Vol. 51, pp. 7309-7321, (2016).

  39. C.-H. Wang* and K.-T. Li, Effects of Ga addition on interfacial reactions between Sn-based solders and Ni, Journal of Electronic Materials, Vol. 45, pp. 6200-6207, (2016).

  40. S.-W. Chen, W.-T. Chiu, W. Gierlotka, J.-S. Chang and C.-H. Wang, Liquidus Projection and Thermodynamic Modeling of a Sn-Ag-Zn System, Journal of Electronic Materials, Vol. 46, pp. 6910-6921, (2017).

  41. C.-H. Wang*, K.-T. Li and K.-H. Chen, Effects of Zn and Ga additions to suppress PdSn4 growth at solder/Pd interface under current stressing, Journal of Electronic Materials, Vol. 47, pp.1-8, (2018).

  42. C.-H. Wang*, M.-H. Li, C.-W. Chiu, and T. Y. Chang, Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn-Ag-Cu solders, Journal of Alloys and Compounds, Vol. 767, pp.1133-1140, (2018).

  43. C.-H. Wang* and C.-Y. Lin, Minor P Doping to Effectively suppress IMC growth in solder joints with electroplated Co(P) metallization, Journal of Electronic Materials, Vol. 48, pp.4552-4561, (2019).

  44. C.-H. Wang*, C.-Y. Kuo, and Y.-B. Guo, Effects of Minor Cu, Ni and Ag Additions on the Reactions Between Sn-Based Solders and Co Substrate, JOM, Vol. 71, pp. 3023-3030, (2019).

  45. S.-W. Chen, Y. Hutabalian, W. Gierlotka, C.-H. Wang, and S.-T. Lu, Phase diagram of Bi–In–Se ternary system, Calphad, Vol. 68, pp. 101744, (2020).

  46. C.-H. Wang*, M.-H. Li, C.-W. Chiu and X.-H. Wang, Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2Te3 Thermoelectric Material, JOM, (2020).

  47. C.-H. Wang*, K.-H. Chen, and J.-Y. Tsai, Minor Ge addition to suppress the IMC growth in interfacial reactions of Co with Sn–Ag–Ge and Sn–Ag–Cu–Ge solders, Journal of Electronic Materials, accepted (2021).

  48. C.-H. Wang*and T.-Y. Chang, Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In-48at.%Sn solders, under revision (2021).

　

　Top

(Before 2008, M.S. and Ph. D in NTHU)

  1. S.-J. Luo, C.-H. Wang, and S.-W. Chen, Phase equilibria of the ternary Ni-Cr-Zr system and interfacial reactions in the Ni-Cr/Zr couples, Metallurgical and Materials Transactions A, Vol. 33, pp. 995-1002, (2002).

  2. C.-H. Lin, S.-W. Chen, and C.-H. Wang, Phase equilibria and solidification properties of Sn-Cu-Ni alloys, Journal of Electronic Materials, Vol. 31, pp. 907-915, (2002).

  3. C.-H. Wang, S.-W. Chen, C.-H. Chang, and J.-C. Wu, Phase equilibria of the ternary Al-Cu-Ni system and interfacial reactions of related systems at 800oC, Metallurgical and Materials Transactions A, Vol. 34, pp. 199-209, (2003).

  4. C.-H. Wang and S.-W. Chen, Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800oC, Metallurgical and Materials Transactions A, Vol. 34, pp. 2281-2287, (2003).

  5. C.-H. Wang and S.-W. Chen, Sn-0.7wt%Cu/Ni interfacial reactions at 250oC, Acta Materialia, Vol. 54, pp. 247-253, (2006).

  6. C.-H. Wang and S.-W. Chen, Electric current effects in the flip chip solder joints, Journal of the Chinese Institute of Chemical Engineers, Vol. 37, pp. 185-191, (2006).

  7. S.-W. Chen and C.-H. Wang, Interfacial reactions of Sn-Cu/Ni couples at 250oC, Journal of Materials Research, Vol. 21, pp. 2270-2277, (2006).

  8. S.-W. Chen, P.-Y. Chen, and C.-H. Wang, Lowering of Sn-Sb alloy melting points caused by substrate dissolution, Journal of Electronic Materials, Vol. 35, pp. 1982-1985, (2006).

  9. S.-W. Chen, C.-H. Wang, S.-K. Lin, and C.-N. Chiu, Phase diagrams of Pb-Free solders and their related materials systems, Journal of Materials Science: Materials in Electronics, Vol. 18, pp. 19-37, (2007).

  10. S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu, and C.-C. Chen, Phase transformation and microstructural evolution in solder joints, JOM, Vol. 59, pp. 39-43. (2007).

  11. S.-W. Chen and C.-H. Wang, Effects of electromigration on interfacial reactions in cast Sn/Cu joints, Journal of Materials Research, Vol. 22, pp. 695-702, (2007).

  12. C.-H. Wang and S.-W. Chen, Cruciform pattern formation in Sn/Co couples, Journal of Materials Research, Vol. 22, pp. 3404-3409, (2007).

  13. C.-N. Chen, C.-H. Wang, and S.-W. Chen, Interfacial Reactions in the Sn-Bi/Te Couples, Journal of Electronic Materials, Vol. 37, pp. 40-44, (2008).

  14. C.-H. Wang and S.-W. Chen, Sn/Co solid/solid interfacial reactions, Intermetallics, Vol. 16, pp. 524-530, (2008).

  15. C.-H. Wang and S.-W. Chen, Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni couples at 210oC, Intermetallics, Vol. 16, pp. 531-537, (2008).

  16. S.-W. Chen, A.-R Zi, P.-Y. Chen, H.-J. Wu, Y.-K. Chen, and C.-H. Wang, Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples, Materials Chemistry and Physics, Vol.111, pp. 17-19, (2008).

  17. S.-W. Chen, P.-Y. Chen, C.-N. Chiu, Y.-C. Huang, and C.-H. Wang, Phase equilibria of Sn-Sb-Ag ternary system (I): Experimental, Metallurgical and Materials Transactions A, Vol. 39, pp. 3191-3198, (2008).

  18. C.-H. Wang and S.-W. Chen, Peltier effect on Sn/Co interfacial reactions, Journal of Electronic Materials, Vol. 38, pp. 655-662, (2009).

　Top

　

　

Conference paper

 (2008~2015, NCCU)

  1. C.-H. Wang, H. Goddin, and A. Greer, Assessment of electromigration effects at copper wire-bonds, 2009, presented at the 138th TMS Annual Meeting, San Francisco, CA, USA.

  2. C.-H. Wang and S.-W. Chen, The peltier effects upon interfacial reactions in the soldering, 2009, presented at the 138th TMS Annual Meeting, San Francisco, CA, USA.

  3. C.-H. Wang and S.-W. Chen, Interesting phenomena observed in the Sn/Co interfacial reactions, 2009, presented at the 138th TMS Annual Meeting, San Francisco, CA, USA.

  4. 郭俊毅、王朝弘，銲料與Co基材之界面反應動力學探討 ，2009年台灣化學工程學會年會論文摘要集(光碟-F048)。

  5. 陳顯鑫、王朝弘，Sn-Zn銲料與Ni之液/固界面反應 ，2009年台灣化學工程學會年會論文摘要集(光碟-F049)。

  6. 沈漢廷、王朝弘，界面反應法合成Cu6Sn5於鋰離子二次電池特性研究 ，2009年台灣化學工程學會年會論文摘要集(光碟-G038)。

  7. C.-H. Wang and C.-Y. Kuo, Interfacial reactions of Co/Sn/Cu Sandwich Structure, 2010, presented at the 139th TMS Annual Meeting, Seattle, WA.

  8. S.-E. Huang, C.-Y. Kuo, and C.-H. Wang, Phase equilibria of the ternary Sn-Pb-Co and Sn-Zn-Co systems, 2010, 13th APCChE, Taipei (光碟-10906).

  9. 賴韋翰、沈漢廷、王朝弘，Sn-Co合金作為鋰離子電池負極材料之研究，2010年中國鑛冶工程學會年會。

  10. W.-H. Lai, H.-T. Shen, and C.-H. Wang, Interactions between Sn and Cu substrate with various surface finishes, 2010, The 5th IMPACT Conference, Taipei.

  11. 郭俊毅、朱柏彥、王朝弘，溫度效應對Sn/Co界面反應之影響，2010年中國材料學會年會論文摘要集(光碟-03-0612)。

  12. P.-Y. Chu, W.-H. Lai, and C.-H. Wang , Fabrication of 3-dimensional structure to improve cycle performance of Sn-based alloys in lithium-ion batteries, 2011, IUMRS-ICA International Conference, Taipei.

  13. W.-H. Lai, P.-Y. Chu, and C.-H. Wang , Thermomigration in Sn/Cu interfacial reactions, 2011, IUMRS-ICA International Conference, Taipei.

  14. P.-Y. Li, H-H. Chen, H.-H. Chen, K.-C. Chen, and C.-H. Wang , Microstructural characterization of Ni5Zn21 at Sn-9Zn/Ni interface, 2011, IUMRS-ICA International Conference, Taipei.

  15. H.-H Chen and C.-H. Wang, Observations on growth of Ga2O3 nanowires with various catalysts, 2011, IUMRS-ICA International Conference, Taipei.

  16. 李柏毅、劉建麟、王朝弘，Cu/Sn-Zn/Ni之界面反應，2011年台灣化學工程學會年會論文集(光碟，E043)。

  17. 程凱琪、王朝弘，銅基材退火熱處理對錫鬚生成之影響，2011年台灣化學工程學會年會論文集(光碟，E044)。

  18. 黃聖恩、溫俊傑、王朝弘，無電鍍鈷-磷合金與錫銲料之界面反應，2011年台灣化學工程學會年會論文集(光碟，E020)。

  19. 劉建麟、李柏毅、王朝弘，回焊過程Ni3Sn4晶粒形態之比較，2011年台灣化學工程學會年會論文集(光碟，E117)。

  20. 蔡易霖、李岱洲、王朝弘，製備三維有序大孔核殼結構(ITO&α-Fe2O3)與其光電性質探討，2011年台灣化學工程學會年會論文集(光碟，D054)。

  21. C.-H. Wang, H.-T. Shen, and W.-H. Lai, Effective suppression of electromigration-induced Cu dissolution by using a Ag barrier layer in lead-free solder joints, 2012, presented at the 141th TMS Annual Meeting, Orlando, FL, USA.

  22. 朱柏彥、梁創閔、王朝弘，Cu6Sn5/Cu核殼陣列結構之鋰離子電池負極材料，2012年台灣材料年會論文集。

  23. 劉建麟、王朝弘，三維多孔基材電沉積氫氧化鈷之擬電容特性研究，2012年台灣材料年會論文集。

  24. 溫俊傑、王朝弘，Sn-3.5Ag-0.5Cu銲料添加不同濃度磷與鎳基材之界面反應 ，2012年台灣材料 年會論文集。

  25. 蔡漢鵬、陳修賢、梁創閩、王朝弘，Sn、Zn摻雜於Ga2O3奈米線之製備與分析，2012年台灣化工年會論文集。

  26. 程凱琪、邱俊暐、溫俊傑、王朝弘，外部應力作用下大量錫擠出物之快速生成，2012年台灣化工年會論文集。

  27. 李柏毅、李冠廷、劉建麟、王朝弘，Sn-Zn合金與Pd基材之液/固界面反應，2012年台灣化工年會論文集。

  28. C.-H. Wang and H.-H.Chen, Linear growth and cruciform pattern formation in Sn-Zn/Ni interfacial reactions, 2013, presented at the 142th TMS Annual Meeting, San Antonio, TX, USA.

  29. 王朝弘、溫俊傑，打線焊點之介金屬相覆蓋率分析技術，2013海峽兩岸先進半導體封裝材料發展趨勢研討會，中國廈門。

  30. 邱俊暐、王朝弘，無電鍍鈷鎢磷合金與錫合金銲料之界面反應，2013年台灣化工年會論文集。

  31. 李冠廷、王朝弘，電流效應對無電鍍鈀/鎳基材與錫銲料界面反應之影響，2013年台灣化工年會論文集。

  32. 蔡漢鵬、劉建麟、王朝弘，三維多孔基材製備管狀氫氧化鎳之擬電容特性研究，2013年台灣化工年會論文集。

  33. 劉建麟、蔡漢鵬、楊念慈、王朝弘，利用三維多孔基材陰極共沉積鈷鎳氫氧化物之擬電容特性研究，2013年台灣化工年會論文集。

  34. 溫俊傑、李美樺、邱俊暐、王朝弘，無電鍍鈷/錫之界面反應與電流作用，2013年台灣化工年會論文集。

  35. C.-H. Wang, P.-Y. Li, and C.-W. Chiu, Interfacial reactions of Sn-Zn solders with Pd and Au/Pd/Ni substrates, 2014, presented at the 143th TMS Annual Meeting, San Diego, CA, USA.

  36. J.-L. Liu, H.-P. Tsai and C.-H. Wang, Nano-flake nickel-cobalt hydroxide electrodeposited on 3D structure current collector as advanced electrodes for supercapacitors, 2014, IUMRS-ICEM International Conference, Taipei.

  37. C.-W. Chiu and C.-H. Wang, Solid/solid interfacial reactions of Sn/Ni(-P)/Bi2Te3-based thermoelectric materials, 2014, IUMRS-ICEM International Conference, Taipei.

  38. 黃聖恩、邱俊暐、林哲揚、王朝弘，Interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate with the influence of the P content，2014年台灣化工年會(學生英文發表競賽)。

  39. 楊念慈、王朝弘，稻殼經鎂熱還原法製備中孔洞結構矽粉作為鋰離子電池負極材料，2014年台灣化工年會。

  40. 蔡漢鵬、黃宣毓、王朝弘，氧化鋅模板輔助成長氫氧化鈷於多孔基材在超級電容器之應用，2014年台灣化工年會。

  41. 李冠廷、蔡霈文、王朝弘，無鉛銲點導入PdSn4層對電遷移破壞研究影響，2014年台灣化工年會。

  42. C.-H. Wang and S.-E. Huang, Interfacial reactions between Sn and electroless Co(P) metallization, 2015, presented at the 144th TMS Annual Meeting, Orlando, FL, USA.

  43. W.-H. Hsu and C.-H Wang, Porous Li4Ti5O12 synthesized by a hydrothermal method for Li-ion battery applications, 2015, 62nd TwIChE Annual Conference.

  44. P.-Y. Ou Yang, J.-L. Liu, H.-Y. Huang, and C.-H. Wang, Pseudocapacitive contribution of Ni(OH)2 formation during cycling test on porous Ni electrode deposited with Co(OH)2 nanoflakes,  2015, 62nd TwIChE Annual Conference.

  45. K.-H. Chen, K.-T. Li, C.-Y. Lin, and C.-H. Wang, Inhibition of PdSn4 growth at Sn/Pd interface with minor Ga addition, 2015, 62nd TwIChE Annual Conference.

  46. P.-W. Tsai, K.-Y. Li, and C.-H. Wang, Preparation of porous silicon as anode materials in Li-ion batteries, 2015, 62nd TwIChE Annual Conference.

  47. M.-H. Li and C.-H. Wang, Interfacial reaction of Bi2Te3-based thermoelectric materials and Sn-Ga solders, 2015, 62nd TwIChE Annual Conference.

  48. H.-Y. Huang and C.-H. Wang, Synthesis of cobalt sulfide and its electrochemical performance for supercapacitors, 2015, 62nd TwIChE Annual Conference.

  49. C.-H. Wang, Determination of the liquid apex of tie-triangle by interfacial reactions, 2015, Annual Conference of Materials Research Society-Taiwan (Invited talk).

  50. 黃柏諺、李冠廷、王朝弘，XSn4介金屬相之電遷移行為研究, 2015, Annual Conference of Materials Research Society-Taiwan.

  51. 林哲揚、王朝弘，微量添加鋅之錫銲料與無電鍍鈷(磷)基材之界面反應, 2015, Annual Conference of Materials Research Society-Taiwan.

  52. C.-H. Wang and K.-T. Li, Strong inhibition of IMC growth at the Sn/Co system by minor Ga addition, 2016, presented at the 145th TMS Annual Meeting, Nashville, TN, USA.

  53. C.-H Wang* and H.-P. Tsai, Synthesis of cobalt hydroxide by zinc oxide template-assisted growth for application in supercapacitors, 67th Annual Meeting of the International Society of Electrochemistry (ISE), Hague, Netherlands.

  54. C.-C. Chou and C.-H. Wang, Synthesis of porous silicon from rice husks as anode material for Li-ion batteries, 2016年台灣化工年會。

  55. P.-W. Tsai and  C.-H. Wang, An easy way to prepare porous Si from SiO2 as anode materials for Li-ion battery, 2016年台灣化工年會。

  56. C.-E. Wu, C.-Y. Lin and C.-H. Wang, Interfacial reactions between lead-free solder joints and electroplated Co(P) diffusion barrier, 2016年台灣化工年會。

  57. C.-Y. Wu, N.-C. Yang and C.-H. Wang, Rice husk-derived porous silicon and Si/C composite materials by magnesiothermic reduction as anode materials for Li-ion batteries, 2016年台灣化工年會。

  58. 陳科行、王朝弘，Sn-3.5Ag銲料添加微量Ge對各基材界面反應之影響，2016年材料年會。

  59. 史斌呈、 徐偉豪、王朝弘，簡易合成多孔鋰鈦氧於鋰離子電池之應用，2016年材料年會 。

  60. C.-H. Wang and C.-Y. Lin, Investigation of the influence of Ni content on electromigration resistance of
    (Pd,Ni)Sn4, 2017, presented at the 14    6th TMS Annual Meeting, San Diego, CA, USA.

  61. C.-Y. Lin and  C.-H. Wang, Minor P-doping to effectively inhibit IMC growth in the interfacial reactions between electroplated Co(P) layer and Pb-free solders, 13th International Conference on Diffusion in Solids and Liquids, Vienna, Austria.

  62. C.-H Wang* and H.-P. Tsai, Synthesis of hollow Co(OH)2 nanorods for a high-performance asymmetric supercapacitor, 5th International Symposium on Enhanced Electrochemical Capacitors (ISEE CAP 2017), Jena, Germany.

  63. C.-Y. Wu and C.-H. Wang, Nitrogen-doped carbon coated porous Si derived from SiO for lithium-ion battery anodes, 2017年台灣化工年會。

  64. 林保璇、王朝弘，Sn-Au-Ni銲料之介金屬相電遷移行為研究，2017年台灣化工年會。

  65. K.-H.Chen, T.-Y. Chang, Y-B. Guo, and C.-H. Wang, Effects of minor Ge addition to Sn-3.5Ag solder on liquid/solid reactions of Co substrate, 2017 IUMRS-ICA.

  66. T.-Y. Chang and C.-H. Wang, Interfacial reactions of Cu/In/Ag/Cu and Cu/In/Sn/Cu, 2017 IUMRS-ICA.

  67. K.-H.Chen and C.-H. Wang, Minor Ge addition to effectively suppress IMC growth in the lead-free solder joints with Co substrate, 2018 IUMRS-ICEM, Dae-Jeon, South Korea.

  68. C.-H. Wang, K.-T. Li and C.-Y. Lin, Minor P-doping in Co Metallization to Effectively Suppress IMC growth in Pb-free solder joints, 2018年台灣化工年會。

  69. Y.-B. Guo and C.-H. Wang, Effect of minor B addition to electroplating Co layer on the interface of lead-free solder joints, 2018年台灣化工年會。

  70. C.-C. Lin and C.-H. Wang, Reduced graphite oxide as anode materials of sodium ion batteries,  2018年台灣化工年會。

  71. 盧志昂、張台諭、王朝弘，In-Sn低溫銲料與Co之液/固界面反應研究，2018年台灣化工年會。

  72. P.-S. Hsieh and C.-H. Wang, Synthesis of porous silicon from silica nanoparticles as anode materials for lithium ion batteries, 2018年台灣電化學年會。

  73. B.-C. Shih and C.-H. Wang, Li4Ti5O12 nanosheets as anode materials for sodium ion batteries, 2018年台灣電化學年會。

  74. C.-H. Wang*, M.-H. Li, C.-W. Chiu, and T.-Y. Chang, Solid-state interfacial reactions of Sn solder joints with Bi2Te3–based thermoelectric materials, 2019, presented at the 148th TMS Annual Meeting, San Antonio, TX, USA.

  75. C. A. Lu and C. H. Wang, Effects of additives on the microstructures of electroplating Co deposits and interfacial reactions with lead-free solders, 2019年台灣化工年會。

  76. Y.-H. Li and C. H. Wang, Interfacial reactions of FeCoNiCrMn high-entropy alloy with lead-free solders, 2019年台灣化工年會。

  77. C.-C. Lin, T.-H. Chu, C. H. Wang, A waste biomass (longan shell) derived hard carbon as anode materials for sodium ion batteries, 2019年台灣化工年會。

  78. 謝昀達、王朝弘，水熱法合成硫化鎳及硫化鈷應用於鋰離子電池與鈉離子電池負極材料之研究，2019年台灣化工年會。

  79. 郭裕斌、蔡竣宇、王朝弘，電鍍Co(B)製程開發與無鉛銲點界面之研究，2019年台灣化工年會。

  80. C.-H. Wang and Y.-B. Guo, Interfacial reactions between lead-free solders and Electroless Co(B) metallization, 2020, presented at the 149th TMS Annual Meeting, San Diego, CA, USA.

  81. 朱廷軒、王朝弘，生質材料製備硬碳應用於鈉離子電池負極材料，2020年台灣化工年會。

  82. 謝昀達、林禹澄、朱廷軒、王朝弘，硫化鎳與硫化鈷鑲嵌於還原氧化石墨烯應用於鈉離子電池負極材料，2020年台灣化工年會。

  83. 王信河、段映竹、王朝弘，無鉛銲點中(Cu,Ni)6Sn5之電遷移行為研究，2020年台灣化工年會。

  84. 蔡竣宇、王朝弘，低磷鈷鍍層之銲點阻障層評估與無電鍍沉積動力學，2020年台灣化工年會。

  85. 郭裕斌、藍珈揚、王朝弘，無電鍍Co(B)擴散阻障層與無鉛銲點之界面反應，2020年台灣化工年會。


　

　



　

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 (Before 2008, M.S. and Ph. D in NTHU)

  1. 羅世杰、王朝弘、陳信文，1999，鎳-鉻合金與鋯的界面反應，中國材料科學學會88年論文集(光碟)，B-35。

  2. 王朝弘、陳信文、張家華、吳貞欽，2000，熔射製程中鍍層與基材界面之相變化，中華民國鑄造學會八十九年度論文發表會論文集，pp. 233-236。

  3. 王朝弘、陳信文、張家華、吳貞欽，Al-Cu-Ni三元系統在800oC下的相平衡及界面反應，2001年中國材料學會年會論文摘要集，P02-11, p. 34。

  4. 王朝弘、陳信文、張家華、吳貞欽，Sn-Cu-Ni三元系統相平衡及界面反應，2001年中國材料學會年會論文摘要集，P02-12, p. 34。

  5. 王朝弘、李守維、陳信文、顧詩章，2002，覆晶銲料隆點之界面反應探討，中華民國第七屆破壞科學研討會論文集(光碟)，B4-07。

  6. 陳信文、陳志銘、王朝弘，2002，無鉛銲料系統之相平衡與界面反應研究，第二屆海峽兩岸清華大學先進材料研討會論文集，pp. 218-219。

  7. S.-W. Chen, S.-H. Wu, C.-M. Chen and C.-H. Wang, 2002, Electromigration effects upon the lead-free solder joints, Oral index #32 (CD), Presented at the 2002 Taiwan/Korea/Japan Chemical Engineering Conference, October 2002, Taipei, Taiwan.

  8. S.-W. Chen, S.-W. Lee, C.-H. Wang and M.-C. Yip, 2003, Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1) wt% Cu/Ni joints (Invited speech), Presented at the 132nd TMS Annual Meeting, San Diego, California.

  9. S.-W. Chen, C.-H. Wang, C.-C. Chen, and S.-K. Lin, 2005, Electric current effects upon interfacial reactions in the solder joints, (Invited speech), Presented at the SEMICON Korea 2005, Seoul, Korea.

  10. C.-H. Wang and S.-W. Chen, Electric current effects in the flip chip solder joints, IMAPS-Taiwan 2005 International Technical Symposium, pp. 190-192.

  11. 王朝弘、陳信文，Sn-0.7wt%Cu/Ni在250oC之界面反應，2005年中國材料學會年會論文摘要集(光碟)，2-1-I-002。

  12. 陳伯胤、王朝弘、陳信文，錫-銻/銀界面反應與錫-銻-銀熱分析，2005年中國材料學會年會論文摘要集(光碟)，2-1-P-004。

  13. 陳信文、王朝弘、林士剛、陳志吉，2005，電流效應對電子產品中界面反應之影響，(Invited speech),中國化學工程學會五十二週年(94年年會)曁國科會化學工程學門成果發表會(光碟)，p.28。

  14. C.-H. Wang and S.-W. Chen, 2006, Cu content and size effects upon the reaction layer detachment in the Sn-Cu/Ni couples, presented at the 135th TMS Annual Meeting, San Antonio, Texas, USA.

  15. S.-W. Chen, P.-Y. Chen and C.-H. Wang, 2006, Melting point lowering of the Sn-Sb alloys caused by substrate dissolution, presented at the 135th TMS Annual Meeting, San Antonio, Texas, USA.

  16. C.-H. Wang and S.-W. Chen, 2006, Cu diffusion in Sn/Cu couples by electromigration, presented at EMRS fall meeting, Warsaw, Poland.

  17. 王朝弘、陳信文，電流作用對Sn/Cu界面反應之影響 ，2006年中國材料學會年會論文摘要集(光碟)，P03-048.

  18. 陳信文、邱政男、王朝弘、林士剛、陳志吉，無鉛銲點界面反應與其相圖，2006中國材料科學學會論文集(光碟)，F05-09.

  19. S.-W. Chen, C.-N. Chiu, S.-K. Lin, C.-H Wang and C.-F Yang, 2007, Interfacial Reactions and Phase diagrams of Pb-Free Solders and Related Materials Systems, Presented at the 136th TMS Annual Meeting, Orlando, Florida, USA.

  20. C.-F. Yang, K.-H. Wu, C.-H. Wang, and S.-W. Chen, 2007, Interfacial Reactions of Sn-8Zn-3Bi Solder with Cu, Ni, and Ag Substrates, presented at the 136th TMS Annual Meeting, February, Orlando, Florida, USA.

  21. C.-H. Wang and S.-W. Chen, Investigation of Sn/Ni interfacial reactions with electric current passage, 2008 Taiwan/ Korea/ Japan ChE conference and 55th TwIChE annual conference, OS1006.

  22. C.-H. Wang and S.-W. Chen, Sn/Co interfacial reactions, 2008, presented at the 137th TMS Annual Meeting, New Orleans, LA, USA.

  23. 王朝弘、邱政男、陳信文，內凹角處界面反應之探討，2008年中國材料學會年會論文摘要集(光碟-OS1006)。



   Patent

  1. 陳信文、王朝弘、陳伯胤、陳建志，“焊接電子零件於基板上的方法及其所製之電子元件”，
    中華民國專利申請，專利公開號    200743419，(2007)。

  2. S.-W. Chen, C.-H. Wang, P.-Y. Chen and Z.-C. Chen, "Method of soldering component to substrate and electronic device made by the same", U.S. Patent application 20070262121, (2007).

     Other publication

  1. 王朝弘、陳信文，材料分析-第20章 熱分析，pp. 564-614，(2014). (中國材料科學學會出版，汪建民主編)

  2. 王朝弘、李祐翔、陳信文,2008,"磁場對電子產品銲點界面反應之影響"，化工，第55卷第5期，pp. 63-72.                                                                                                                                                                                                                                                                                                             Top

　

　

　

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